{COUNTERFOIL}: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras
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2020. {COUNTERFOIL}: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras. 29th USENIX Security Symposium (USENIX Security 20). :1255--1272.