RESIN: A Holistic Service for Dealing with Memory Leaks in Production Cloud Infrastructure

Title{RESIN}: A Holistic Service for Dealing with Memory Leaks in Production Cloud Infrastructure
Publication TypeConference Paper
Year of Publication2022
AuthorsLou C, Chen C, Huang P, Dang Y, Qin S, Yang X, Li X, Lin Q, Chintalapati M
Conference Name16th USENIX Symposium on Operating Systems Design and Implementation (OSDI 22)
Date Published07/2022
PublisherUSENIX Association
Conference LocationCarlsbad, CA
ISBN Number978-1-939133-28-1
URLhttps://www.usenix.org/conference/osdi22/presentation/lou-resin